In 2020 the founding team of Seemic received first prize of the 2020 National Science and Technology Progress Award in advanced packaging.
The award recognized a systematic breakthrough in advanced packaging technology, which is directly continuous with the advanced packaging metrology capability the company focuses on today. Yield control in advanced packaging depends heavily on fast, non-destructive characterization of interconnect structures, dielectric layers and micro-void topography — precisely why Seemic places wafer micro-void metrology at the core of its product line.
The team continues to translate this engineering experience into the algorithms, accuracy and stability of its metrology instruments.