Specifications
| Measurement mode | Spectroscopic ellipsometry |
|---|---|
| Polarization modulation | Dual rotating compensator modulation (optional) |
| Spectral range | 380 to 1000 nm |
| Film thickness range | 1 nm to 10 μm |
| Film thickness repeatability | Within 0.005 nm (100 nm SiO2/Si, 30 measurements) |
| Refractive index repeatability | Within 0.0002 (n at 632.8 nm, 100 nm SiO2/Si, 30 measurements) |
| Single-point measurement time | Within 10 s |
| Spot size | Within 200 μm (optional) |
| Incidence angle | Fixed angle, automatic angle module (optional) |
| Optical models | Cauchy, Sellmeier, Lorentz, Drude |
| Data output | TXT, CSV and other formats |
Overview
This spectroscopic ellipsometer is a precision optical instrument for universities, research institutes and industrial users. It measures and analyzes nano film thickness, material optical constants and multi-layer film structures, covering semiconductor materials, optical coatings, functional films and emerging optoelectronic materials.
Based on spectroscopic ellipsometry, the instrument detects the polarization change of light reflected from the sample, obtains the ellipsometric parameters Psi and Delta, and combines them with optical models and data fitting to characterize film thickness (d), refractive index (n) and extinction coefficient (k).
Principle and Measurable Parameters
- Measurement mode: spectroscopic ellipsometry
- Measurable parameters: film thickness d, refractive index n, extinction coefficient k
- Spectral range: 380 to 1000 nm
- Film thickness range: 1 nm to 10 μm
- Film thickness repeatability: within 0.005 nm (100 nm SiO2/Si, 30 measurements)
- Refractive index repeatability: within 0.0002 (n at 632.8 nm, 100 nm SiO2/Si, 30 measurements)
- Single-point measurement time: within 10 s
Common dispersion models are supported, including Cauchy, Sellmeier, Lorentz and Drude, together with single-layer and multi-layer film modeling and parameter fitting.
Configuration Options
- Standard spectroscopic ellipsometry
- Multi-angle measurement (fixed angle, automatic angle module optional)
- Micro-area measurement (spot size down to 200 μm and laser-assisted autofocus, optional)
- Automatic wafer Mapping (multi-point scan and 2D/3D film thickness distribution analysis, optional)
- Samples: various sizes and types of flat samples, with optional sample stage
- Data output: TXT, CSV and other formats supported
Applications
- Optical constant calibration of semiconductor thin films
- Thickness and refractive index measurement for optical coatings and functional films
- Research on emerging optoelectronic materials
- Fundamental experiments and teaching in universities and research institutes
- Consistency sampling of wafer-level multi-layer film structures