Seemic launches two metrology instruments together: the POLARIS-F100 spectroscopic ellipsometer for films and optical constants, and the TITAN-M100 wafer micro-void metrology equipment for high aspect ratio micro-voids. The three product lines — optical critical dimension, spectroscopic ellipsometry and wafer micro-void metrology — are now complete.
POLARIS-F100 spectroscopic ellipsometer
Based on spectroscopic ellipsometry, the instrument detects the polarization change of light reflected from the sample, obtains the ellipsometric parameters Psi and Delta, and combines them with optical models and data fitting to characterize film thickness (d), refractive index (n) and extinction coefficient (k). The spectral range is 380 to 1000 nm, the film thickness range is 1 nm to 10 μm, and film thickness repeatability is within 0.005 nm.
Standard spectroscopic, multi-angle, micro-area and automatic wafer Mapping configurations are planned, with customization available to match customer requirements across research and industrial inspection scenarios.
TITAN-M100 wafer micro-void metrology equipment
The equipment targets high aspect ratio micro-void arrays in advanced 3D stacking packaging and IC wafer fabrication, applied mainly to the geometric dimension and topography characterization of TSV structures.
TSV micro-voids are small, deep, structurally complex and hard to measure. The instrument integrates angle-resolved optical scattering, white-light interferometry, reflection spectroscopy and confocal microscopy so that critical dimension, depth and topography tasks can each be served, providing quantitative support for etch process window optimization and other manufacturing control tasks.