The core Seemic team holds four granted invention patents in semiconductor metrology and advanced packaging, covering the full chain from test structure design and algorithm modeling to device fabrication.
Patent list
- Simplified test structure design method for detecting system defects ZL 2020 1 1573097.7, publication CN 112685889 B, granted 2022-04-29
- Method for generating an optical property modeling database based on ANN ZL 2020 1 1584307.2, publication CN 112699095 B, granted 2024-02-02
- Measurement model construction method and measurement method for stacked nanosheet structures ZL 2022 1 0154984.3, publication CN 114623777 B, granted 2022-11-18
- Co-packaged optoelectronic device and its fabrication method ZL 2025 1 0537879.1, publication CN 120469014 B, granted 2026-03-24
The filings span 2020 to 2025, with Wuhan University as patentee and the core technical team as inventors. The portfolio covers defect-detection test structures, artificial-neural-network based modeling database generation, nanostructure measurement model construction and co-packaged optoelectronic device fabrication, aligning with the current non-contact optical metrology and advanced packaging roadmap.